Understanding and controlling residual stresses in thick polycrystalline diamond cutters for enhanced durability

https://suncrestdiamonds.com/wp-content/uploads/2019/02/residual-stress-2000.pdf

Residual stresses in PDC cutters arise from the difference in thermal expansion between the polycrystalline diamond layer and the supporting tungsten carbide substrate after sintering at high pressure and temperature. If not managed correctly, these stresses can significantly reduce the toughness of the cutters, especially as the diamond-layer thickness increases.

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